Lynk Labs ThermaLynk™
ThermaLynk is Lynk Labs latest technological breakthrough and includes 2 new patented methods of packaging LEDs including LED packages made of thermal conductive plastics and “Chip On Luminaire” “COL”™ – LED die placed directly on a thermally conductive plastic molded into any form of end product such as an automotive tail light, traffic signal or backlight for displays.
With ThermaLynk technology, a complex traditional LED package (such as shown below in figure 2 .) can be transformed into a simple structure molded of thermal conductive polymers .
Fig 2
Since ThermaLynk reduces the material count needed to fabricate an LED package, thermal resistance in the package is reduced thereby increasing efficiency of the LED package.
The result, as shown in figure 3., is an LED package structure molded with thermal conductive polymers into any size and 3D net shape that dissipates heat more uniformly and in almost every direction. Electrically conductive materials can even be used to replace lead frames by coating molded lead frames formed within the LED package with conductive material.
Fig 3
an even more elegant COL structure such as fig 4
Fig 4
This is where the fundamental cost change occurs. Today’s LED packaging process at the discrete device level comprises multiple steps and materials. Once ThermaLynk technology is taken to Chip On Luminaire production phase, multiple materials and processes are eliminated’ creating a profound shift in the cost structure needed to take LEDs to broad market applications and consumer penetration.
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